Integrally formed single piece light emitting diode light wire and uses thereof

ABSTRACT

An integrally formed single piece light emitting diode (LED) light wire that provides a smooth, uniform lighting effect from all directions of the LED light wire. The integrally formed single piece LED light wire includes a support substrate, a conductive base formed on the support substrate, the conductive bus comprising a plurality of conductive bus elements, at least one conductive segment arranged between the plurality of conductive bus elements, the at least one conductive segment comprising at least one LED. The integrally formed single piece LED light wire may include built-in sensors/detectors and/or a plurality of LED modules with individually controlled LEDs via microprocessors. The integrally formed single piece LED light wire may also include an interlocking alignment system which permits the coupling of at least two LED light wires. Further, a plurality of the integrally formed single piece LED light wires may create a lighting panel.

CROSS-REFERENCE TO RELATED APPLICATIONS

This utility application is a continuation of U.S. Ser. No. 12/355,655,filed Jan. 16, 2009, now U.S. Pat. No. 8,052,303, issued Nov. 8, 2011,which is a continuation-in-part of U.S. application Ser. No. 11/854,145,filed Sep. 12, 2007, now U.S. Pat. No. 7,988,332, issued Aug. 2, 2011,which claims priority to U.S. Provisional Patent Application Ser. No.60/844,184, filed Sep. 12, 2006, the entirety of which is incorporatedherein by reference.

Throughout this application, several publications are referenced.Disclosure of these references in their entirety is hereby incorporatedby reference into this application.

The present invention relates to light wires and, more specifically, anintegrally formed single piece of light wire containing light emittingdiodes (“LEDs”), and the uses of such LED light wire, wherein the LEDsand associated circuitry of the LED light wire are protected frommechanical damage and environmental hazards, such as water and dust.

BACKGROUND THE INVENTION

Conventional incandescent or LED light wires are commonly used in avariety of indoor and outdoor decorative or ornamental lightingapplications. For example, such conventional light wires are used tocreate festive holiday signs, outline architectural structures such asbuildings or harbors, and provide under-car lighting systems. Theselight wires are also used as emergency lighting aids to increasevisibility and communication at night or when conditions, such as poweroutages, water immersion and smoke caused by fires and chemical fog,render normal ambient lighting insufficient for visibility.

Conventional LED light wires consume less power, exhibit a longerlifespan, are relatively inexpensive to manufacture, and are easier toinstall when compared to light tubes using incandescent light bulbs.Increasingly, LED light wires are used as viable replacements for neonlight tubing.

As illustrated in FIG. 1, conventional light wire 100 consists of aplurality of illuminant devices 102, such as incandescent light bulbs orLEDs, connected together by a flexible wire 101 and encapsulated in aprotective tube 103. A power source 105 creates an electrical currentthat flows through the flexible wire 101 causing the illuminant devices102 to illuminate and create an effect of an illuminated wire. Theilluminant devices 102 are connected in series, parallel, or incombination thereof. Also, the illuminant devices 102 are connected withcontrol electronics in such a way that individual illuminant devices 102may be selectively switched on or off to create a combination of lightpatterns, such as strobe, flash, chase, or pulse.

In conventional light wires, the protective tube 103 is traditionally ahollow, transparent or semi-transparent tube which houses the internalcircuitry (e.g., illuminant devices 102; flexible wire 101). Since thereis an air gap between the protective tube 103 and internal circuitry,the protective tube 103 provides little protection for the light wireagainst mechanical damage due to excessive loads, such as the weight ofmachinery that is directly applied to the light wire. Furthermore, theprotective tube 103 does not sufficiently protect the internal circuitryfrom environmental hazards, such as water and dust. As a result, theseconventional light wires 100 with protective tube 103 are foundunsuitable for outdoor use, especially when the light wires are exposedto extreme weather and/or mechanical abuse.

In conventional light wires, wires, such as flexible wire 101, are usedto connect the illuminant devices 102 together. In terms ofmanufacturing, these light wires are traditionally pre-assembled usingsoldering or crimp methods and then encapsulated via a conventionalsheet or hard lamination process in protective tube 103. Suchmanufacturing processes are labor intensive and unreliable. Furthermore,such processes decrease the flexibility of the light wire.

In response to the above-mentioned limitations associated withconventional light wires and the manufacture thereof, LED light stripshave been developed with increased complexity and protection. These LEDlight strips consist of circuitry including a plurality of LEDs mountedon a support substrate containing a printed circuit and connected to twoseparate electrical conductors or bus elements. The LED circuitry andthe electrical conductors are encapsulated in a protective encapsulantwithout internal voids (which includes gas bubbles) or impurities, andare connected to a power source. These LED light strips are manufacturedby an automated system that includes a complex LED circuit assemblyprocess and a soft lamination process. Examples of these LED lightstrips and the manufacture thereof are discussed in U.S. Pat. Nos.5,848,837, 5,927,845 and 6,673,292, all entitled “Integrally FormedLinear Light Strip With Light Emitting Diode”; U.S. Pat. No. 6,113,248,entitled “Automated System For Manufacturing An LED Light Strip HavingAn Integrally Formed Connected”; and U.S. Pat. No. 6,673,277, entitled“Method of Manufacturing a Light Guide”.

Although these LED light strips are better protected from mechanicaldamage and environmental hazards, these LED light strips only provideone-way light direction, and are limited to two separate bus elements inits internal LED circuitry. Also, the manufacturing of such LED lightstrips remains expensive and time-consuming since these LED light stripsat least require a protective encapsulant free of internal voids andimpurities, as well as crimping each LED connector pin to the internalLED circuitry. Further, the lamination process makes these LED lightstrips too rigid to bend.

SUMMARY OF THE INVENTION

In light of the above, there exists a need to further improve the art.Specifically, there is a need for an improved integrally formed singlepiece LED light wire that is flexible and provides a smooth, uniformlighting effect from all directions of the integrally formed singlepiece LED light wire. Furthermore, there is also a need for an LED lightwire with additional lighting functions which is manufactured by a lowcost, time-efficient automated process.

An integrally formed single piece LED light wire, comprising a supportsubstrate; a conductive base formed on the support substrate, theconductive base comprising a first, second, third and fourth conductivebus elements; at least one conductor segment arranged between the firstand second conductive bus elements, the at least one conductor segmentcomprising at least one LED; and at least one sensor coupled to thethird and fourth conductive bus elements, the third conductive buselement is adapted to transmit signals from the at least one sensor, andthe fourth conductive bus is adapted to provide power to the at leastone sensor.

According to an embodiment of the integrally formed single piece LEDlight wire, the second conductive bus element is a ground and the atleast one sensor is additionally coupled to the second conductive buselement.

According to an embodiment of the integrally formed single piece LEDlight wire, includes an encapsulant completely encapsulating the supportsubstrate, the conductive base, the at least one conductor segment andthe at least one sensor. The encapsulant may include light scatteringparticles.

According to an embodiment of the integrally formed single piece LEDlight wire, includes a plurality of conductor segments, wherein theplurality of conductor segments comprising a plurality of LEDs connectedin series.

According to an embodiment of the integrally formed single piece LEDlight wire, includes a plurality of conductor segments, wherein theplurality of conductor segments comprises a plurality of LEDs connectedin series and parallel.

According to an embodiment of the integrally formed single piece LEDlight wire, the first, second, third and fourth conductive bus elementsand the at least one conductor segment is made of braided wire.

An integrally formed single piece LED light wire, comprising a supportsubstrate; first and second conductive bus elements formed on thesupport substrate, wherein the first conductive bus element is adaptedto distribute power from a power source, and the second conductive buselement is a ground; and at least two LED modules, each LED modulecomprising a microprocessor, at least one LED, power input and outputconnections, control signal input and output connections, and data inputand output connections, wherein the control signal and data inputconnections of each LED module are coupled to the control signal anddata output connections of an adjacent LED module, wherein the powerinput connection of a first LED module is coupled to the firstconductive bus element, the power output connection of a second LEDmodule is coupled to the second conductive bus element and the powerinput connections of every other LED module are coupled to the poweroutput connections of adjacent LED modules.

According to an embodiment of the integrally formed single piece LEDlight wire, at least one LED module includes a plurality of LEDs,wherein the plurality of LEDs are selected from the group consisting ofred, blue, green, and white LEDs.

According to an embodiment of the integrally formed single piece LEDlight apparatus, includes an encapsulant completely encapsulating thesupport substrate, the first and second conductive bus elements, and theat least two LED modules. The encapsulant may include light scatteringparticles.

According to an embodiment of the integrally formed single piece LEDlight wire, the first and second conductive bus elements is made ofbraided wire.

According to an embodiment of the integrally formed single piece LEDlight wire, the outer profile of the encapsulant comprises an alignmentkey and an alignment keyhole located at opposite sides of the integrallyformed single piece LED light wire.

A lighting panel comprising a plurality of the integrally formed singlepiece LED light wires described in this application.

An integrally formed single piece LED light wire, comprising a supportsubstrate; first and second conductive bus elements formed on thesupport substrate, wherein the first conductive bus element is adaptedto distribute power from a power source, and the second conductive buselement is a ground; and at least two LED modules, each LED modulecomprising a microprocessor, at least one LED, power input and outputconnections. control signal input and output connections, and data inputand output connections, wherein the control signal and data inputconnections of each LED module are coupled to the control signal anddata output connections of an adjacent LED module, wherein the powerinput connection of each LED module is coupled to the first conductivebus element and the power output connection of each LED module iscoupled to the second conductive bus element.

BRIEF DESCRIPTION OF THE FIGURES

For the purposes of illustrating the present invention, the drawingsreflect a form which is presently preferred; it being understoodhowever, that the invention is not limited to the precise form shown bythe drawings in which:

FIG. 1 is a representation of a conventional light wire;

FIG. 2 is a top view illustrating an integrally formed single piece LEDlight wire according to an embodiment of the present invention;

FIG. 3 is a cross-sectional view of the integrally formed single pieceLED light wire shown in FIG. 2;

FIG. 4A is a side view of an integrally formed single piece LED lightwire according to another embodiment of the present invention;

FIG. 4B is a top view of the integrally formed single piece LED lightwire shown in FIG. 4B;

FIG. 5A is a cross-sectional view of the integrally formed single pieceLED light wire shown in FIGS. 4A & 4B;

FIG. 5B is a cross-sectional view of an integrally formed single pieceLED light wire according to another embodiment of the present invention;

FIG. 6A is an embodiment of a conductive base;

FIG. 6B is a schematic diagram of the conductive base of FIG. 6A;

FIG. 7A is another embodiment of a conductive base;

FIG. 7B is a schematic diagram of the conductive base of FIG. 7A;

FIG. 8A is another embodiment of a conductive base;

FIG. 8B is a schematic diagram of the conductive base of FIG. 8A;

FIG. 9A is another embodiment of a conductive base;

FIG. 9B is a schematic diagram of the conductive base of FIG. 9A;

FIG. 10A is another embodiment of a conductive base;

FIG. 10B is a schematic diagram of the conductive base of FIG. 10A;

FIG. 11A is another embodiment of a conductive base;

FIG. 11B is a schematic diagram of the conductive base of FIG. 11A;

FIG. 11C depicts an embodiment of a conductive base wrapped on a coreprior to encapsulation;

FIG. 12A depicts an embodiment of an LED mounting area of a conductivebase;

FIG. 12B depicts an LED mounted on the LED mounting area shown in FIG.12A;

FIG. 13 depicts LED chip bonding in another embodiment of an LEDmounting area;

FIG. 14A depicts the optical properties of an integrally formed singlepiece LED light wire according to an embodiment of the presentinvention;

FIG. 14B depicts a cross-sectional view of a dome-shaped encapsulant andthe optical properties thereof;

FIG. 14C depicts a cross-sectional view of a flat-top-shaped encapsulantand the optical properties thereof;

FIGS. 15A-C depict a cross-sectional view of three different surfacetextures of the encapsulant;

FIG. 16A is a schematic diagram of an integrally formed single piece LEDlight wire according to an embodiment of the present invention;

FIG. 16B depicts an embodiment of the integrally formed single piece LEDlight wire shown in FIG. 16A;

FIG. 16C is a block diagram illustrating the integrally formed singlepiece LED light wire shown in FIG. 16B;

FIG. 17A is a block diagram of an integrally formed single piece LEDlight wire according to another embodiment of the present invention;

FIG. 17B is a cross-sectional view of the integrally formed single pieceLED light wire shown in FIG. 17A;

FIG. 17C is a block diagram illustrating an integrally formed singlepiece LED light wire according to an embodiment of the presentinvention;

FIG. 18 is a block diagram illustrating an integrally formed singlepiece LED light wire containing at least a sensor or detector accordingto an embodiment of the present invention;

FIG. 19A is a schematic diagram of a full color integrally formed singlepiece LED light wire according to an embodiment of the presentinvention;

FIG. 19B is a block diagram illustrating an embodiment of the integrallyformed single piece LED light wire shown in FIG. 19A;

FIG. 20 is a schematic diagram of a control circuit for a full colorintegrally formed single piece LED light wire;

FIG. 21 is a timing diagram for a full color integrally formed singlepiece LED light wire;

FIG. 22A is a timing diagram for a full color integrally formed singlepiece LED light wire;

FIG. 22B is a timing diagram for a full color integrally formed singlepiece LED light wire;

FIG. 23 is a schematic diagram of an integrally formed single piece LEDlight wire containing a plurality of LED modules according to anembodiment of the present invention;

FIG. 24 is a layout diagram of the integrally formed single piece LEDlight wire shown in FIG. 23;

FIG. 25A is a block diagram illustrating a lighting panel comprising aplurality of integrally formed single piece LED light wires withinterlocking alignment system according to an embodiment of the presentinvention;

FIG. 25B is a cross-sectional view of the lighting panel shown in FIG.25A; and

FIG. 25C is a cross-sectional view of a lighting panel comprising aplurality of integrally formed single piece LED light wires according toanother embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention relates to an integrally formed single piece LEDlight wire containing a plurality of LEDs that are connected in series,parallel or a combination thereof on at least one conductive bus elementwhich forms a mounting base or on at least two conductive bus elementsmounted on a support substrate made of insulating material (e.g.,plastic) to provide a combined mounting base. Both types of mountingbase provides an (1) electrical connection, (2) a physical mountingplatform or a mechanical support for the LEDs, and (3) a light reflectorfor the LEDs. The mounting base and LEDs are encapsulated in atransparent or semi-transparent encapsulant which may contain lightscattering particles.

In one embodiment of the present invention, as shown in FIGS. 2 and 3,an integral single piece LED light wire, which includes a sub-assembly310 comprising at least one LED 202 connected to a conductive base 201,the sub-assembly 310 is encapsulated within an encapsulant 303, and theconductive base 201 comprises one conductive bus element formed from aconductive material capable of distributing power from a power source.As shown in FIG. 2, the LEDs 202 are connected in series. Thisembodiment offers the advantage of compactness in size, and allows theproduction of a long, thin LED light wire with an outer diameter of 3 mmor less. The conductive base 301 is operatively connected to a powersource 305 to conduct electricity.

In another embodiment, as illustrated in FIGS. 4A, 4B, and 5A, thepresent invention may be an integrally formed single piece LED lightwire comprising a plurality of sub-assemblies 510. Each sub-assembly 510consists of at least one LED 202 connected to a conductive base, whereinthe conductive base 401 has two conductive bus elements 401A and 401B.The sub-assemblies 510 are encapsulated within an encapsulant 503. Asshown, the LEDs 202 are connected in parallel. The conductive base 401is operatively connected to a power source 405 to activate LEDs 202.

In another embodiment, as shown in FIG. 5B, the present invention mayinclude a plurality of sub-assemblies 701. Each sub-assembly 750includes at least one LED 202 (for example, a SMD-On-Board LED)connected to a conductive base 94 having at least two conductive buselements 94A and 94B, wherein the conductive base 94 is mounted on asupport substrate 90.

AC or DC power from a power source, such as power source 405, may beused to power the integrally formed single piece LED light wire.Additionally, a current source may be used. Brightness may be controlledby digital or analog controllers.

The conductive base 94, 201, 401 extends longitudinally along the lengthof the integrally formed single piece LED light wire, and act as an (1)electrical conductor, (2) a physical mounting platform or a mechanicalsupport for the LEDs 202, and (3) a light reflector for the LEDs 202.

The conductive base 201, 401 may be, for example, punched, stamped,printed, silk-screen printed, or laser cut, or the like, from a metalplate or foil to provide the basis of an electrical circuit, and may bein the form of a thin film or flat strip. The conductive bus elements ofconductive base 94, 201, 401, and conductive segments (discussed below)may also be formed using rigid electrical conductive materials (such asmetal rod, metal strip, copper plate, copper clad steel plate, metalstrip, a rigid base material coated with an electrically conductivematerial, or the like), or flexible electrical conductive materials(such as thin metal strip, copper clad alloy wire, stranded wire,braided wire, or the like). Stranded wire or braided wire may be flat orround, and comprises a plurality of electrical conductive fine wiresmade of copper, brass, aluminum, or the like; such fine wires may bebare or coated with electrical conductive materials including, but notlimited to, tin, nickel, silver, or the like. Metal, mentioned in thisparagraph, may include copper, brass, aluminum, or the like. In apreferred embodiment, flat braided wire is used as conductive buselements or conductive segments.

The conductive bus elements of conductive base 94 may be mounted on asupport substrate 90 via adhesion, lamination, extrusion, or casting.The support substrate 90 may be made of rigid or flexible plastic, suchas polyethylene terephthalate (PET), polyvinyl chloride (PVC), andthermoplastic polyurethane (TPU).

Additional circuitry, such as active or passive control circuitcomponents (e.g., a microprocessor, a resistor, a capacitor), may beadded and encapsulated within an encapsulant to add functionality to theintegrally formed single piece LED light wire. Such functionality mayinclude, but not limited to, current limiting (e.g., resistor 10),protection, flashing capability, or brightness control. For example, amicrocontroller or microprocessor may be included to make the LEDs 202individually addressable; thereby, enabling the end user to control theillumination of selective LEDs 202 in the LED light wire to form a′variety of light patterns, e.g., strobe, flash, chase, or pulse. In oneembodiment, external control circuitry is connected to the conductivebase 94, 201, 401.

First Embodiment of the Conductive Base

In a first embodiment of the conductive base assembly 600, shown in FIG.6A, the base material of the conductive base 601 is preferably a longthin narrow metal strip or foil. In one embodiment, the base material iscopper. A hole pattern 602, shown as the shaded region of FIG. 6A,depict areas where material from the conductive base 601 has beenremoved. In one embodiment, the material has been removed by a punchingmachine. The remaining material of the conductive base 601 forms thecircuit of the present invention. Alternatively, the circuit may beprinted on the conductive base 601 and then an etching process is usedto remove the areas 602. The pilot holes 605 on the conductive base 600act as a guide for manufacture and assembly.

The LEDs 202 are mounted either by surface mounting or LED chip bondingand soldered, welded, riveted or otherwise electrically connected to theconductive base 601 as shown in FIG. 6A. The mounting and soldering ofthe LEDs 202 onto the conductive base 601 not only puts the LEDs 202into the circuit, but also uses the LEDs 202 to mechanically hold thedifferent unpunched parts of the conductive base 601 together. In thisembodiment of the conductive base 601 all of the LEDs 202 areshort-circuited, as shown in FIG. 6B. Thus, additional portions ofconductive base 601 are removed as discussed below so that the LEDs 202are not short-circuited. In one embodiment, the material from theconductive base 601 is removed after the LEDs 202 are mounted.

Second Embodiment of the Conductive Base

To create series and/or parallel circuitries, additional material isremoved from the conductive base. For example, additional portions ofthe conductive base are removed between the terminals of the LEDs 202after the LEDs 202 are mounted on the conductive base; thereby, creatingat least two conductors wherein each conductor is electrically separate,but then coupled to each other via the LEDs 202. As shown in FIG. 7A,the conductive base 701 has an alternative hole pattern 702 relative tothe hole pattern 602 depicted in FIG. 6A. With the alternative holepattern 702, the LEDs 202 (such as the three shown in FIGS. 7A and 7B)are connected in series on the conductive base 701. The seriesconnection is shown in FIG. 7B, which is a schematic diagram of theconductive base assembly 700 shown in FIG. 7A. As shown, the mountingportions of LEDs 202 provide support for the conductive base 701.

Third Embodiment of the Conductive Base

In a third embodiment of the conductive base, as shown in FIG. 8A, aconductive base assembly 800 is depicted having a pattern 802 is punchedout or etched into the conductive base 801. Pattern 802 reduces thenumber of punched-out gaps required and increase the spacing betweensuch gaps. Pilot holes 805 act as a guide for the manufacturing andassembly process. As shown in FIG. 8B, the LEDs 202 are short-circuitedwithout the removal of additional material. In one embodiment, thematerial from conductive base 801 is removed after the LEDs 202 aremounted.

Fourth Embodiment of the Conductive Base

As illustrated in FIG. 9A, a fourth embodiment of the conductive baseassembly 900 contains an alternative hole pattern 902 that, in oneembodiment, is absent of any pilot holes. Compared to the thirdembodiment, more gaps are punched out in order to create two conductingportions in the conductive base 901. Thus, as shown in FIG. 9B, thisembodiment has a working circuit where the LEDs 202 connected in series.

Fifth and Sixth Embodiments of the Conductive Base

FIG. 10A illustrates a fifth embodiment of conductive base assembly 1000of the conductive base 1001. Shown is a thin LED light wire with atypical outer diameter of 3 mm or less. As shown in FIG. 10A, (1) theLEDs 202 connected on the conductive base 1001 are placed apart,preferably at a predetermined distance. In a typical application, theLEDs 202 are spaced from 3 cm to 1 m, depending upon, among otherthings, at least the power of the LEDs used and whether such LEDs aretop or side-emitting. The conductive base 1001 is shown absent of anypilot holes. The punched-out gaps that create a first hole pattern 1014that are straightened into long thin rectangular shapes. The gaps 1030under the LEDs 202 are punched out after the LEDs 202 are mounted toconductive base 1001, or, in the alternative, LEDs 202 are mounted overpunched-out gaps 1030. However, as shown in FIG. 10B, the resultantcircuit for this embodiment is not useful since all the LEDs 202 areshort-circuited. In subsequent procedures, additional material isremoved from conductive base 1001 so that LEDs 202 are in series orparallel as desired.

In the sixth embodiment of the conductive base assembly 1100, conductivebase 1101, as shown in FIG. 11A, contains a hole pattern 1118 whichcreates a working circuit in the conductive base 1101 with a seriesconnections of LEDs 202 mounted onto the conductive base 1101. Thisembodiment is useful in creating a thin LED light wire with a typicaloutside diameter of 3 mm or less.

LEDs

The LEDs 202 may be, but are not limited to, individually-packaged LEDs,chip-on-board (“COB”) LEDs, leaded LEDs, surface mount LEDs,SMD-On-Board LEDs, or LED dies individually die-bonded to the conductivebase 301. The PCB for COB LEDs and SMD-On-Board LEDs may be, forexample, FR4 PCB, flexible PCB, or metal-core PCB. The LEDs 202 may alsobe top-emitting LEDs, side-emitting LEDs, or a combination thereof.

The LEDs 202 are not limited to single colored LEDs. Multiple-coloredLEDs may also be used. For example, if Red/Blue/Green LEDs (RGB LEDs)are used to create a pixel, combined with a variable luminance control,the colors at each pixel can combine to form a range of colors.

Mounting of LEDs onto the Conductive Base

As indicated above, LEDs 202 are mounted onto the conductive base bymethods known in the art, including surface mounting, LED chip bonding,spot welding and laser welding.

In surface mounting, as shown in FIGS. 12A and 12B, the conductive base1201 is first punched to assume any one of the embodiments discussedabove, and then stamped to create an LED mounting area 1210. The LEDmounting area 1210 shown is exemplary, and other variations of the LEDmounting area 1210 are possible. For example, the LED mounting area 1210may be stamped into any shape which can hold an LED 202, or not stamped.

A soldering material 1210 (e.g., liquid solder; solder cream; solderpaste; and any other soldering material known in the art) or conductiveepoxy is placed either manually or by a programmable assembly system inthe LED mounting area 1220, as illustrated in FIG. 12A. LEDs 202 arethen placed either manually or by a programmable pick and place stationon top of the soldering material 1210 or a suitable conductive epoxy.The conductive base 1201 with a plurality of LEDs 202 individuallymounted on top of the soldering material 1210 may directly go into aprogrammable reflow chamber where the soldering material 1210 is meltedor a curing oven where the conductive epoxy is cured. As a result, theLEDs 202 are bonded to the conductive base 1201 as shown in FIG. 12B.

As illustrated in FIG. 13, LEDs 202 may be mounted onto the conductivebase 1301 by LED chip bonding. The conductive base 1301 is stamped tocreate a LED mounting area 1330. The LED mounting area 1330 shown inFIG. 13 is exemplary, and other variations of the LED mounting area1330, including stamped shapes, like the one shown in FIG. 12A, whichcan hold an LED, are envisioned. LEDs 202, preferably an LED chip, areplaced either manually or by a programmable LED pick place machine ontothe LED mounting area 1330. The LEDs 202 are then wire bonded onto theconductive base 1301 using a wire 1340. It should be noted that wirebonding includes ball bonding, wedge bonding, and the like.Alternatively, LEDs 202 may be mounted onto the conductive base 301using a conductive glue or a clamp.

It should be noted that the conductive base in the above embodiments canbe twisted in an “S” shape. Then, the twisting is reversed in theopposite direction for another predetermined number of rotations;thereby, making the conductive base form a shape of a “Z”. This “S-Z”twisted conductive base is then covered by an encapsulant. With its“S-Z” twisted placement, this embodiment will have increasedflexibility, as well as emit light uniformly over 360°.

In another embodiment, as shown in FIG. 11C, conductive base (e.g.,conductive base 1101) delivering electrical current to the LEDs is woundinto spirals. The spiraling process can be carried out by a conventionalspiraling machine, where the conductive base is placed on a rotatingtable and a core 9000 passes through a hole in the center of the table.The pitch of the LED is determined by the ratio of the rotation speedand linear speed of the spiraled assembly. The core 9000 may be in anythree-dimensional shape, such as a cylinder, a rectangular prism, acube, a cone, a triangular prism, and may be made of, but not limitedto, polymeric materials such as polyvinyl chloride (PVC), polystyrene,ethylene vinyl acetate (EVA), polymethylmethacrylate (PMMA) or the like,or, in one embodiment, elastomer materials such as silicon rubber. Thecore 9000 may also be solid. In one embodiment, the conductive basedelivering electrical current to the LEDs is wound into spirals on asolid plastic core and then encapsulated in a transparent elastomerencapsulant.

Encapsulant

The encapsulant provides protection against environmental elements, suchas water and dust, and damage due to loads placed on the integral LEDlight wire. The encapsulant may be flexible or rigid, and transparent,semi-transparent, opaque, and/or colored. The encapsulant may be madeof, but not limited to, polymeric materials such as polyvinyl chloride(PVC), polystyrene, ethylene vinyl acetate (EVA), polymethylmethacrylate(PMMA) or other similar materials or, in one embodiment, elastomermaterials such as silicon rubber.

Fabrication techniques concerning the encapsulant include, withoutlimitation, extrusion, casting, molding, laminating, injection molding,or a combination thereof.

In addition to its protective properties, the encapsulant assists in thescattering and guiding of light in the LED light wire. As illustrated inFIG. 14, that part of the light from the LEDs 202 which satisfies thetotal internal reflection condition will be reflected on the surface ofthe encapsulant 1403 and transmitted longitudinally along theencapsulant 1403. Light scattering particles 1404 may be included in theencapsulant 1403 to redirect such parts of the light as shown by lightpath 1406, as well as attenuate or eliminate hot spots of light. Thelight scattering particles 1404 are of a size chosen for the wavelengthof the light emitted from the LEDs. In a typical application, the lightscattering particles 1404 have a diameter in the scale of nanometers andthey can be added to the polymer either before or during the extrusionprocess.

The light scattering particles 1404 may also be a chemical by-productassociated with the preparation of the encapsulant 1403. Any materialthat has a particle size (e.g., a diameter in the scale of nanometers)which permits light to scatter in a forward direction can be a lightscattering particle.

The concentration of the light scattering particles 1404 is varied byadding or removing the particles. For example, the light scatteringparticles 1404 may be in the form of a dopant added to the startingmaterial(s) before or during the extrusion process. Also, air bubbles orany other internal voids may be used as a light scattering particle1404. The concentration of the light scattering material 1404 within theencapsulant 1403 is influenced by the distance between LEDs, thebrightness of the LEDs, and the uniformity of the light. A higherconcentration of light scattering material 1404 may increase thedistance between neighboring LEDs 202 within the LED light wire. Thebrightness of the LED light wire may be increased by employing a highconcentration of light scattering material 1404 together within closerspacing of the LEDs 202 and/or using brighter LEDs 202. The smoothnessand uniformity of the light within the LED light wire can be improved byincreasing the concentration of light scattering material 1404 mayincrease such smoothness and uniformity.

As shown in FIGS. 3, 5A and 5B, the sub-assemblies 310, 510 and 750 aresubstantially at the center of the encapsulant. The sub-assemblies 310,510 and 750 are not limited to this location within the encapsulant. Thesub-assemblies 310, 510 and 750 may be located anywhere within theencapsulant. Additionally, the cross-sectional profile of theencapsulant is not restricted to circular or oval shapes, and may be anyshape (e.g., square, rectangular, trapezoidal, star). Also, thecross-sectional profile of the encapsulant may be optimized to provideeither a narrow or wide viewing angle (see light paths 1450 and 1460 inFIGS. 14B (dome-shaped profile of encapsulant 222) and 14C (flat-topprofile of encapsulant 223), respectively) and/or lensing for lightemitted by the LEDs 202. For example, another thin layer of encapsulantmay be added outside the original encapsulant to further control theuniformity of the emitted light from the present invention.

Surface Texturing and Lensing

The surface of the integral LED light wire can be textured and/or lensedfor optical effects. The integral single piece LED light wire may becoated (e.g., with a fluorescent material), or include additional layersto control the optical properties (e.g., the diffusion and consistencyof illuminance) of the LED light wire. Additionally, a mask may beapplied to the outside of the encapsulant to provide different texturesor patterns.

Different design shapes or patterns may also be created at the surfaceof the encapsulant by means of hot embossing, stamping, printing and/orcutting techniques to provide special functions such as lensing,focusing, and/or scattering effects. As shown in FIGS. 15A-C, thepresent invention includes formal or organic shapes or patterns (e.g.,dome, waves, ridges) which influences light rays 1500 to collimate (FIG.15A), focus (FIG. 15B), or scatter/diffuse (FIG. 15C). The surface ofthe encapsulant may be textured or stamped during or following extrusionto create additional lensing. Additionally, the encapsulant 93, 303 and503 may be made with multiple layers of different refractive indexmaterials in order to control the degree of diffusion.

Applications of Integrally Formed Single Piece LED Light Wire

The present invention of the integrally formed single piece LED lightwire finds many lighting applications. The following are some examplessuch as LED light wires with 360° Illumination, full color LED lightwires, LED light wires with sensor or detectors, and LED light wireswith individually controlled LEDs. Also, the LED light wires may alignedside-by-side or stacked in order to create a lighting panel. It shouldbe noted that these are only some of the possible light wireapplications.

The three copper wires 161, 162, 163 delivering electrical power to theLEDs 202 shown in FIG. 16B forming the conductive base may be wound intospirals (see FIG. 11C). The LEDs are connected to the conductors bysoldering, ultrasonic welding or resistance welding. Each neighboringLED can be orientated at the same angle or be orientated at differentangles. For example, one LED is facing the front, the next LED is facingthe top, the third LED is facing the back, and the fourth one is facingthe bottom etc. Thus, the integrally formed single piece LED light wirecan illuminate the whole surrounding in 360°.

An embodiment of the integrally formed single piece LED light wire isshown in FIGS. 16B and 16C. As shown, there are two continuousconductors corresponding to conductive bus elements 161 and 163. Zeroohm jumpers or resistors 10 couple conductor segments 162 to conductivebus elements 161 and 163 to provide power to LED elements 202. As shownin FIG. 16B, the LED light wire includes a support substrate 90. In apreferred embodiment, the support substrate is flexible. In anotherembodiment, the LED light wire with flexible support substrate is woundabout a core 9000 (see, for example, FIG. 11C), and then is encapsulatedin an encapsulant.

The integrally formed single piece LED light wire is not limited tosingle color. For full color application, the single color LED isreplaced by multiple LEDs or an LED group consisting of four sub-LEDs infour different colors: red, blue, green, and white as shown in FIG. 20.The intensity of each LED group (one pixel) can be controlled byadjusting the voltage applied across each sub-LED. The intensity of eachLED is controlled by a circuit such as the one shown in FIG. 20.

In FIGS. 20, L1, L2, and L3 are the three signal wires for supplyingelectric powers to the four LEDs in each pixel. The color intensity ofeach sub-LED is controlled by a μController 6000 with the timing chartgiven in FIG. 21.

As shown in FIG. 21, because the line voltage L2 is higher than the linevoltage L1 over the first segment of time, the red LED (R) is turned on,whereas, during the same time interval, all the other LEDs are reversebiased and hence they are turned off. Similarly, in the second timeinterval, L2 is higher than L3 thus turning on the green LED (G) andturning off all the other LEDs. The turning on/off of other LEDs insubsequent time segments follows the same reasoning.

New colors such as cold white and orange apart from the four basic onescan be obtained by mixing the appropriate basic colors over a fractionof a unit switching time. This can be achieved by programming amicroprocessor built into the circuit. FIG. 22A and FIG. 22B show thetiming diagrams of color rendering for cold white and orangerespectively. It should be noted that the entire color spectrum can berepresented by varying the timing of signals L1, L2, and L3.

In one embodiment of the invention, each pixel of LEDs can be controlledindependently using a microprocessor circuit into the light wire asshown in FIG. 23. Each LED module 2100 is assigned a unique address.When this address is triggered, that LED module is lit up. It will benoted that each pixel is an LED module consists of a micro-controllerand three (RGB) or four (RGBW) LEDs. The LED modules are seriallyconnected with a signal wire based on daisy chain or star busconfiguration. Alternatively, the LED modules 2100 are arranged inparallel.

There are two ways to assign an address for each LED module. In a firstapproach, a unique address for each pixel is assigned during themanufacturing process. In a second approach, each pixel is assigned anaddress dynamically with its own unique address and each pixel beingcharacterized by its own “address” periodically with trigger signal.Alternatively, the address is assigned dynamically when powered on. Thedynamic addressing has the advantage of easy installation, as theintegrally formed single piece LED light wire can be cut to any length.In one embodiment, the light wire can be cut into any desired lengthwhile it is powered on and functioning.

FIGS. 17A-17C depict an embodiment of the LED light wire using a seriesand parallel connection. This embodiment allows the LEDs to be turnedthrough 90° (positioned transversely instead of longitudinally) andmounted at a much closer pitch.

As shown in FIGS. 18 thru 19B and 24, the integrally formed single pieceLED light wire may have a plurality of conductors (e.g., conductive buselements and conductive segments) which are coupled by zero ohm jumpersor resistors, LEDs, sensors, detectors and/or microprocessors, and aremounted on a support substrate. The functionality of the LED light wireincreases with each additional conductor. For example, a sensor ordetector which monitors environment conditions (such as humidity,temperature, and brightness) may be integrated in the LED light wire,and connected in such a manner that it may influence the lightingcharacteristics of the LED light wire. FIG. 18 shows an embodiment ofthe integrally formed single piece LED light wire with sensors ordetectors. As shown, there are four continuous conductors correspondingto conductive bus elements 30, 32, 33 and 34. Zero ohm jumpers orresistors 10 couple conductive segments 31 to conductive bus elements 30and 32. Conductor bus element 32 acts as a common ground. Conductive buselement 30 provides power to the LEDs 202, while conductive bus element34 provides power to the sensor/detector 100. Conductive bus element 33may direct the signal from the sensor/detector 100 to a power sourcewhich supplies power to the LEDs 202; thereby, allowing thesensor/detector 100 to influence the lighting characteristics (e.g.,intensity, color, pattern, on/off) of the LEDs 202.

FIGS. 19A and 19B show a full color integrally formed single piece LEDlight wire having three continuous conductors corresponding toconductive bus elements L1, L2 and L3 which supply power to the LEDs202, and conductor segments S1 and S2 connecting the LEDs 202 toconductive bus elements L1, L2 and/or L3. In FIG. 19B, the LEDs 202 areSMD-On-Board LEDs.

In another embodiment, each pixel of LEDs (or LED module) may becontrolled independently. FIG. 24 shows the configuration of anindividually controllable LED light wire using seven conductors and LEDmodules 2120. Here, conductive bus element 80 acts as a power ground,while conductive bus element 81 acts as a voltage in. Each LED module2120 includes a microprocessor, at least one LED, power input and outputconnections, control signal input and output connections, and data inputand output connections. In FIG. 24, the LED modules 2120 include VCCpins, VDD pins, enable pins, clock pins and data pins. The controlsignal and data input connections of each LED module are coupled to thecontrol signal and data input connections of an adjacent LED module. Anoptocoupler may be used to insulate the control signal line between eachLED module. The LED modules 2120 may be connected in series (forexample, as shown in FIG. 24) or in parallel (for example, the powerinput connections of each LED module 2120 is coupled to the firstconductive bus element 81 and the power output connection of each LEDmodule 2120 is coupled to the second conductive bus element 80).

A plurality of integrally formed single piece LED light wires (such asLED light wire 12, 13, 14) may be aligned side-by-side to form alighting panel 3000 as shown in FIGS. 25A-25C. Each LED light wire maycontain an interlocking alignment system comprising an alignment key 60,62 and an alignment keyhole 61, both of which are pre-formed in theencapsulant of the LED light wire, wherein the alignment key 60, 62 andthe alignment keyhole 61 are located at opposite sides of the LED lightwire. The alignment key 60, 62 and the alignment keyhole 61, 63 maycontinuously extend or intermittently extend longitudinally along thelength of the LED light wire. The alignment keyhole 61, 63 may be in theform of a notch, a groove, a recess, a slot, or an aperture, and thealignment key 60, 62 may be in a form (including, but withoutlimitation, a rail or a peg) which permits a friction fit (preferably, asnug fit) to the alignment keyhole 61, 63. The alignment key 60, 62 mayhave a width approximately equal to or slightly larger than the width ofthe alignment keyhole 61, 63, such that the alignment key 60, 62 may fittherein in a friction fit, as shown in FIGS. 25B and 25C. As an example,the alignment keyhole 61, 63 may be a groove being adapted to frictionfit with a rail-shaped alignment key 60, 62, both groove-shapedalignment keyhole 61, 63 and rail-shaped alignment 60 continuouslyextending longitudinally along the length of the LED light wire.

Although specific embodiments have been illustrated and describedherein, it will be appreciated by those of ordinary skill in the artthat a variety of alternate and/or equivalent implementations may besubstituted for the specific embodiments shown and described withoutdeparting from the scope of the present invention. This application isintended to cover any adaptations or variations of the specificembodiments discussed herein. Therefore, it is intended that thisinvention be limited only by the claims and the equivalents thereof.

What is claimed is:
 1. An integrally formed single piece LED light wire,comprising: a conductive base comprising a first, second, third andfourth conductive bus elements; at least one conductor segment arrangedbetween the first and second conductive bus elements, the at least oneconductor segment comprising at least one LED; and at least one sensorcoupled to the third and fourth conductive bus elements.
 2. Theintegrally formed single piece LED light wire of claim 1, wherein thesecond conductive bus element is a ground and the at least one sensor isadditionally coupled to the second conductive bus element.
 3. Theintegrally formed single piece LED light wire of claim 1, furthercomprising an encapsulant completely encapsulating the conductive base,the at least one conductor segment and the at least one sensor.
 4. Theintegrally formed single piece LED light wire of claim 3, wherein theencapsulant further comprises light scattering particles.
 5. Theintegrally formed single piece LED light wire of claim 1, furthercomprising a plurality of conductor segments, wherein the plurality ofconductor segments comprising a plurality of LEDs connected in series.6. The integrally formed single piece LED light wire of claim 1, furthercomprising a plurality of conductor segments, wherein the plurality ofconductor segments comprises a plurality of LEDs connected in series andparallel.
 7. The integrally formed single piece LED light wire of claim1, wherein the first, second, third and fourth conductive bus elementsand the at least one conductor segment is made of braided wire.
 8. Anintegrally formed single piece LED light wire, comprising: first andsecond conductive bus elements, wherein the first conductive bus elementis adapted to distribute power from a power source, and the secondconductive bus element is a ground; and at least two LED modules, eachLED module comprising a microprocessor, at least one LED, power inputand output connections, control signal input and output connections, anddata input and output connections, wherein the power input connection ofa first LED module is coupled to the first conductive bus element, thepower output connection of a second LED module is coupled to the secondconductive bus element and the power input connections of every otherLED module are coupled to the power output connections of adjacent LEDmodules.
 9. The integrally formed single piece LED light wire of claim8, wherein at least one LED module further comprises a plurality ofLEDs, wherein the plurality of LEDs are selected from the groupconsisting of red, blue, green, and white LEDs.
 10. The integrallyformed single piece LED light apparatus of claim 8, further comprisingan encapsulant completely encapsulating the first and second conductivebus elements, and the at least two LED modules.
 11. The integrallyformed single piece LED light wire of claim 10, wherein the encapsulantfurther comprises light scattering particles.
 12. The integrally formedsingle piece LED light wire of claim 8, wherein the first and secondconductive bus elements is made of braided wire.
 13. The integrallyformed single piece LED light wire of claim 3 or 10, wherein the outerprofile of the encapsulant comprises an alignment key and an alignmentkeyhole located at opposite sides of the integrally formed single pieceLED light wire.
 14. A lighting panel comprising a plurality of theintegrally formed single piece LED light wires of claim
 13. 15. Anintegrally formed single piece LED light wire, comprising: first andsecond conductive bus elements, wherein the first conductive bus elementis adapted to distribute power from a power source, and the secondconductive bus element is a ground; and at least two LED modules, eachLED module comprising a microprocessor, at least one LED, power inputand output connections, control signal input and output connections, anddata input and output connections, wherein the power input connection ofeach LED module is coupled to the first conductive bus element and thepower output connection of each LED module is coupled to the secondconductive bus element.